Semi-automated x-ray inspection system for none destruction inspection of SMD, BGA, QFP, CSP, sockets, Micro-SMD components solder joints, material quality etc.
X-ray Inspection System X5600
- SMT/Semicon/Solar/Connector/LED IC/PCB
- High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire
- 90KV 15 um closed X-ray tube,with long life,maintenance in free
- 1.3million high resolution digital flat panel detector
- Color image navigation
- Automatic programming detection and automatic analysis Not good or Pass
- More modular panels observation point setting
1) Defect inspection in IC encapsulation, e.g.: layer separation, cracking, void, and line integrity.
2) Measuring chip size, measuring line curvature, measuring the proportion of solder area of components.
3) Possible defects in PCB manufacturing processes, e.g.: misalignment, solder bridge and open.
4) SMT solder short, cold solder, component shifted, solder insufficient, solder void inspection and measurement.
5) Defect inspection of open, short or abnormal connections that may occur in automotive wiring harnesses and connectors.
6) Inner rupture or hollow inspection in plastic or metal.
7) Battery stacking uniformity, electrode welding inspection.
8) Seed, biological material inspection etc.
|X-RAY launch tube||Tube type||Closed X-ray tube|
|Maximum tube voltage||90kV|
|Maximum tube current||0.12mA|
|Focal spot size||15μm|
|Detector||Image speed||20 fps|
|Cabinet Specifications||Table size||250mm*250mm|
|Dimension||Length: 930mm, width: 710mm, height: 1070mm|
|Input voltage||AC 110-220V (+10%) (international standard power supply)|
|X-ray leakage amount||≤0.3 u Sv/hr|
|Operating system||Windows 7 Seamark3.0|