Semi-automated rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc.
ST-100WS mini ACF bonding machine
our ST-100WS is a small hot press pulse heating bonding machine with single head. It is designed for TV led lcd display screen panel repair.
ST-100WS can repair TV screen up to 100inches. It is a mini bonding machine with 2 CCD camera and one hot press bonding head in size 50*1.4mm. We also can provide bonding machine head in other sizes like 68*1.4mm and 50*1.2mm.
This model ST-100SS is in small size which can save your shipping cost and storage space. It is a bonding machine with low price but same good performance. It is our hot sell bonding machine.
Feel free to contact us for the lastest bonding machine prices.
* Images of our bonding machine for TV led lcd screen panel repair
Bonding machine Spare parts
Spare parts are provided for repairing bonding machine in warranty. The Warranty for all our TV bonding machines is one year.
bonding machine accessories
The bonding machine price includes the cost of accessories. You only need to buy COF then you can operate the bonding machine and start your TV repair.
|Device Description||Screen repair equipment, LCD repair equipment, COF/TAB bonding equipment, etc.|
|Device Uses||This product is used in a variety of FPC, COF, TAB and LCD Panel and PCB combination bonding, is reflected in a variety of sizes LCD vertical, horizontal, vertical band, horizontal belt, black belt, black, colored thread, ribbon , multi-line, black, black and white, vertical half display,horizontal half breakdown maintenance.|
|Device Features||Single head ,single pneumatic device, single temperature control|
Multi-speed pulse source design to meet the power requirements of diversified product pressure
|Applicable LCD panel specifications||15"-65"(Platform expandable)|
|Applicable LCD panel thickness||0.3-1.1mm[Single glass]|
|Bonding IC number||One/PANEL|
|Bonding direction||X or Y Unidirection|
|Bonding head size||Replaceable blade according to IC specifications (The original machine is equipped (50X1.4X10).|
|Equipment process time||TFT，3.8S/chip|
|Bonding accuracy||±1.5µm (support 4K)|
|Highest positioning accuracy setting||±0.5μm|
|Equipment requirements work environment||Clean, dust-free, clean room|
|Supply pressure||0.1~0.7Mpa Dry air source|
|Power supply||AC 220V±10%，50HZ，3500W|
|Pneumatic device||Air TAC Original precision cylinder|
|Pressure system||Pressure system parallel bar structure eliminates the weight of the indenter,pressure minimum accuracy can up to 0.1 KG,pressure components are using SMC precision components.|
|Heating method||Pulse (rapid heating/cooling and auxiliary cooling)|
|Temperature Control System||Adjustable temperature rise curve with high precision PID auto-tuning|
The peak temperature : within +/-1degrees Celsius
|Hot pressing head||Material: Titanium alloy|
Plane precision (hot pressing surface) :0.001mm
Plane thickness 0.5 (keep 3 times grinding)
|Thermocouple Type||K type Original US OMEGA wire|
|Industrial control unit / programme||Panasonic PLC FX－C14T|
Panasonic Image Processing System
|Touch unit||Display control Samkoon dual-core touch screen|
|COF fixture||COF mechanical clamping type ,Z-direction tilt radius micrometer fine- tuning|
|Lens spinner unit||Control mode: X / Y / Z micrometer control|
Focus Adjustment: Manually adjust the focus
|Silicone / Teflon||Manual switching position|
|LCD stage (platform)||Manual slide movement|
|Bonding head alignment||The cylinder can be set to stop in any position in the upper and lower directions|
|Control method||Touch screen + button operation|
|Rated voltage||AC 180-220V|
|Peak power||400-1100W (can support 68X1.4X10 wide bonding head)|
|Net weight of equipment||250KG|
|Number of packages||2|
|Equipment packaging||Wooden boxes, non-logs (material is glued board, no fumigation is required for export)|
|Package size and gross weight||920X920X1660mm（L*W*H）240KG Machine|
1920X240X960mm（L*W*H） 110KG Glass
- Rework Process Inspection Camera